High-end epoxy resin flame retardant and curing
2024-02-02
| Chemical Name | Product grade | Cas No. | Content | Introduction | Appearance | |
| Diphenylphosphine Oxide | DPO | 4559-70-0 | ≥98% | Diphenylphosphine Oxide is an important intermediate for halogen-freeated flame retardant, which can be used as a reactive halogen-free flame retardant for epoxy resin copper clad laminates. It shows high flame retardant efficiency, glass-transistion temperature, heat resistance, fluidity, low water absorption and low dielectric properties. | White solid |  |
| 9,10-Dihydro-9-Oxa-10-Phosphaphenanthrene-10-Oxide | DPPO | 35948-25-5 | ≥98% | It can be used for the flame retardation of a wide range of polymer materials, such as linear polyesters, epoxy resins, bismaleimides, etc. It is widely used for the flame retardation of electronics, synthetic fibres, semiconductor encapsulation materials. Due to its special functions, it can also be used in the chemical modification of polymer materials. In addition, they can also be used as insecticides, fungicides, curing agents, antioxidants, stabilisers, photoinitiators, binders, blocking agents for harmful metal ions, light colouring agents for organic substances and UV absorbers. | White powder |  |
| Hexaphenoxy Cyclotriphosphazene | HPCP | 1184-10-7 | ≥99% | Hexaphenoxy Cyclotriphosphazene is an additive halogen-free flame retardant, mainly used in epoxy resin laminates, PC, PC/ABS, PPO, polyolefin and polyester resin materials, etc. Generally, when the addition amount is 7%-15%, the flame retardant grade of the products can reach V-0, and its flame retardant performance is due to the traditional phosphorus-bromine flame retardant system. It can be used in the preparation of copper-clad boards and EMC for large-scale integrated circuit packaging, as well as in benzoxazine resin glass cloth laminates, LED light-emitting diodes, powder coatings and some other polymer materials. | White solid |  |
| Bisphenol F | BPF | 620-92-8 | ≥90% | It is used in the synthesis of epoxy, polycarbonate, polyester and phenolic resins, flame retardants, antioxidants and surfactants. | White crystal |  |
| 4,4′-Methylenebis (3-chloro-2,6-diethyIaniline) | MCDEA | 106246-33-7 | ≥98.0% | The product has good compatibility and compatibility with TDI prepolymer, and the PU products prepared have excellent physical and dynamic mechanical properties, and can be used in PU casting, spraying, RIM and other technological methods. | Off-white crystal or powder |  |
| 4,4'-Methylenebis(2-ethylbenzenamine) | MOEA | 19900-65-3 | ≥97.5% | It has good compatibility and compatibility with TDI and MDI pre-polymers, and has a fast reaction rate. It can be used with E100 for reaction injection moulding and polyurea spraying process, and the products have excellent physical and dynamic mechanical properties. It can also be used as a curing agent for epoxy resins to give the products good tensile, tear resistance, electrical insulation and heat resistance properties. | White powder |  |
| 4,4'-Methylenebis(2-ethyl-6-methylaniline) | MMEA | 19900-72-2 | ≥98.0% | Used as a polyurethane curing agent. | Yellow brown to brown powder particles |  |
| 4,4′-Methylenebis (2,6-diethyIaniline) | MDEA | 13680-35-8 | ≥99.0% | It can be used as a polyurethane chain extender and epoxy curing agent. | White crystal or powder |  |
| 4,4'-Methylenebis(2,6-Diisopropylaniline) | MDIPA | 19900-69-7 | ≥97.0% | This product is an epoxy curing agent for use in chemically resistant coatings for the building industry. It provides good kinetic hydrolytic stability and low water absorption for polyurethane. | Brown solid |  |
| Dimethyl 5,5'-methylenebis(2-aminobenzoate) | MMAB | 31383-81-0 | 95.0% | It can be used as a polyurethane chain extender and epoxy curing agent. | White powder |  |